Customer-focused 112G Solutions
Today’s 112 Gigabit Ethernet (112GbE) module form factors offer the flexibility to satisfy various needs and environments across the Ethernet ecosystem and are targeted for massive aggregation of data across an array of applications.
112G External Cabling
Featured Product Portfolio
- Due to the demands on next generation high-speed designs, TE has developed one of the most comprehensive, flexible and high performing internal and external connector and cable assembly portfolios in the market.
- TE’s continued participation in standards development has led to all form factors being supported, developing a variety of options in DAC, ACC, AEC, and AOC.
- Cycle time on design follows key industry standards while continuously being improved to meet the high demands of our customers and partners.
- Both design and manufacture supported, allowing for vertical supply chain integration and design leadership in industry.
Product support for SFP, SFP-DD, QSFP, QSFP-DD, OSFP, and OSFP-XD interconnects. Cabling options include:
- Direct Attached Copper Cables (DAC)
- Active Copper Cables (ACC)
- Active Electrical Cable (AEC)
- Active Copper Cables (AOC)
- I/O Connectors and Cages
Superior Signal Integrity Solutions of the 112G Product Portfolio
Electrical interfaces at 112 Gbps are a critical enabler of faster, more efficient and cost effective networks and data centers. TE is at the forefront of developing these solutions with industry leaders to bring our customers the fastest speeds combined with the best performance. Our solutions are able to support speeds up to 112 Gbps, and are ready to help your design your next-gen high-speed solutions.
112G Portfolio Key Benefits
- Due to the demands on next generation high-speed designs, TE Connectivity (TE) has developed one of the most comprehensive, flexible and high performing internal and external connector and cable assembly portfolios in the market.
- Next generation products aligned with or exceeding the industry's 112G channel performance needs, delivering best in class cross talk, return loss, insertion loss performance.
- Standard external I/O form factors enable ecosystem connectivity for intra-rack and inter-rack applications.
- Copper cable solutions provide cost-effective system design and connectivity options to achieve the performance demands of 112G architectures.
TE Connectivity’s (TE) 112G Portfolio Solutions provide a holistic approach to product and customer support, with a wide array of flexible and robust offerings to enable next generation architectures.
TE Connectivity’s (TE) 112G Portfolio Solutions offer a holistic approach to product and customer support, with a wide array of flexible solutions and the ability to tailor a customized next generation solution to the needs of the end user. Our 112G product catalog supports standard form-factors and performance requirements, designed with reliability and upgradability in mind, enabling applications including server compute/storage, high-speed networking and artificial intelligence/machine learning.
TE Connectivity’s (TE) 112G product portfolio provides a robust and flexible array of solutions to enable next generation architectures, able to support a wide array of configurations and end user applications. Please download the DesignCon2022 Whitepaper to see what TE is creating to help support new technologies, customers, and solutions.
112G Product Catalog
Sliver Interconnects for SFF-TA-1002
- The Sliver connector was incorporated into the new industry standard SFF-TAA-1002 specification which was adopted in reference applications by OCP, EDSFF and Gen-Z.
- Chosen for performance, density, flexibility and robustness
- Offerings: mid-board connectors, card edge connectors and cable assemblies
112G Per Lane I/O Solutions
- We are at the forefront of developing 112G per lane solutions for 800G and lower aggregate port bandwidths. Our designs are MSA compliant and deliver high performance.
- Thermal management is becoming challenging across high speed IO connectors. TE has a wide portfolio of cage designs and mounts to fit various forced air and liquid cooling architectures dissipating 25W+ powers.
- Offerings: OSFP, QSFP-DD, QSFP, SFP, SFP-DD, CDFP.
Sliver Internal Cabled Interconnects
- Slim interface supports wide variety of protocols
- Rated up to 112G PAM4 and 56G NRZ
- Sliver products comply with SFF-TA-1002 specification
Mini-SAS HD Connectors and Cable Assemblies
- Industry-proven solution to address SFF-8086, 8087, and 8088 standards.
- Supports SAS 2.0, SAS 2.1, SAS 3 and PCIe applications.
- Rated up to 6 Gbps and 12 Gbps.
Cabled STRADA Whisper Backplane Connectors
- Flexible solution to run longer channels.
- Support 112G PAM4 and 56G NRZ Excellent EMI performance.
- Cable receptacle also available.
Busbar Power Assemblies
Supports 112G Operations
- Solutions for 12V and 48V+ Requirements.
- Benefits: Reliable and Robust Power delivery.
- Offerings: Board mount, Flexible braided wire, Pin and socket and cables available for versatility and customization.
Busbar Power Connectors
Supports 112G Operations
- Solutions for power delivery in server, switch, wireless, industrial control and modular power supplies. Commonly used in rack-mounted equipment with busbar architecture.
- Benefits: Reliable, Low resistance, Robust
- Applications: IT Tray, Cubby Shelf, Battery Backup Unit (BBU) and Power Shelf
The 800G QSFP-DD active copper cable (ACC) demonstrates the latest in TE’s bulk cable and termination technology. A retimer embedded in the module extends the reach of copper cables while consuming less power than equivalent optical cables. ACC technology also enables fine wire gauges for short links to ease routing challenges in dense next-gen racks. This live demo shows eight lanes of 112G PAM-4 data running through TE’s ACC with a host trace and connector on each side.
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DesignCon 2019: 112G Cable Enabled Architectures
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High Speed Input/Output & OTB Portfolio Overview (English)
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DesignCon 2020 Live Demo - 112G STRADA Whisper Backplane Connections (English)
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